Breadboard Half Size Bare 400 Tie Points
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Breadboard Half Size Bare 400 Tie Points

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80BDT90
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Technical Overview

The Breadboard Half Size Bare 400 Tie Points is a reliable and versatile solderless prototyping board designed for students, engineers, hobbyists, and embedded systems developers. Featuring 400 connection points with a standard 2.54 mm (0.1-inch) grid pattern, it provides a convenient platform for building and testing electronic circuits without soldering. Its durable ABS plastic housing and integrated dual power rail configuration ensure stable component placement and easy power distribution. Ideal for microcontroller projects, sensor interfacing, robotics applications, and rapid circuit prototyping, this compact breadboard allows components to be easily inserted, removed, and rearranged for efficient experimentation and development. Featured by Famephase Electronic Accessories.

TypeSolderless Prototyping Breadboard (Half size)
Suitable ForCircuit Prototyping, Arduino, Sensors & Robotics Projects
Base MaterialABS Plastic & Phosphor Bronze Contacts
Allowed Wire Size (AWG)29–20
Maximum Operating Current3–5 A